Sonics Adds Three New NoC Licensees in China

Milpitas, Calif. – December 8, 2015  Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today announced that it has signed three new licensees of SonicsGN, the company’s flagship interconnect product, in China. The new customers include: ZTE–one of the country’s largest mobile technology companies; Artosyn, a provider of subsystems for drones (see related press release ARTOSYN LICENSES SonicsGN ON-CHIP NETWORK TO INTEGRATE DRONE SoC); and, a leading fabless provider of enterprise solid-state storage (SSD) chips.

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Artosyn Licenses SonicsGN On-Chip Network to Integrate Drone SoC

Milpitas, Calif. – December 8, 2015  Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today announced that Artosyn Microelectronics (Shanghai, China) has licensed SonicsGN, the company’s flagship NoC product. Artosyn is using SonicsGN as the IP integration technology for a new system-on-chip (SoC) design that combines several drone functions, which were previously separate chips, into a single device.

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Sonics Upgrades SoC Development Environment and Flagship NoC to Improve Chip Architecture Optimization and SoC Resiliency

Static Performance Analysis Speeds Network and SoC Configuration; Timeout Error Detection Accelerates System Bring Up

Milpitas, Calif. – November 17, 2015  Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today introduced new versions of its SonicsStudio system-on-chip (SoC) development environment and SonicsGN NoC. Sonics has enhanced the Director graphical user interface in SonicsStudio release 8.1 to be more responsive with larger SoC designs and to deliver fast, static performance analysis that aids designers in optimizing their SoC architecture to satisfy their application requirements across the full range of system use cases. SonicsGN release 3.1 includes new timeout error detection capability that identifies IP cores that fail to accept or complete their required transactions. Such error conditions typically result from either software defects in IP core programming or transient hardware failures. In addition, Sonics has improved its legacy interface support for ARM AMBA-based SoC designs.

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Sonics Supports ARM P-Channel Interface to Extend Commitment to AMBA Ecosystem

Greg Ehmann to Present on SoC Power Management at ARM TechCon

Milpitas, Calif. – November 10, 2015  Sonics, Inc., the world’s leading supplier of on-chip network (NoC) technologies and services, today announced that it is extending its support for the ARM, AMBA ecosystem by implementing the P-Channel interface in the Sonics ICE-Grain Power Architecture. The strength of the AMBA ecosystem is that it enables companies like Sonics to offer interoperable, value-added technologies for the benefit of customers through open access to interface specifications.

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Wave Semiconductor Licenses SonicsGN On-Chip Network

Sonics’ NoC Provides Superior IP Integration, Multi-channel Memory Access, and SoC Performance and Power Management Capabilities

Milpitas, Calif. – October 13, 2015  Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today announced that Wave Semiconductor (www.wavesemi.com) has licensed SonicsGN, the company’s flagship NoC product. Wave is using SonicsGN to integrate a massively parallel array of custom processing elements with third-party IP in its system-on-chip (SoC) design for machine learning and other compute-intensive applications.

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Sonics and AlphaChips Collaborate to Develop Advanced SoC Design Platforms

Korean Design Service Company to Use SonicsGN NoC for IP Integration and the ICE-Grain Power Architecture for SoC Power Management

Milpitas, Calif. – July 7, 2015  Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today announced that it is collaborating with AlphaChips, a Korean semiconductor design services company, on the development of advanced SoC design platforms. Sonics will provide the SonicsGN NoC for integration of semiconductor IP and consult with AlphaChips on the front-end RTL design flow for the SoC platforms. In addition, Sonics will work closely with AlphaChips on power management specification and implementation for the SoC platforms based on its recently introduced ICE-Grain Power Architecture.

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Sonics Improves NoC Concurrency Management for SoC Designs with Multi-Channel Memory Sub-systems, Addresses Place & Route Tool Restrictions

SonicsGN 3.0 Expands Patented IMT to Exploit Transaction Parallelism and Increases User Control of Hierarchical RTL Partitioning to Guide Physical Design

Milpitas, Calif. – June 23, 2015  Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today released SonicsGN 3.0, the latest version of the company’s flagship NoC. SonicsGN 3.0 expands on the interleaved multi-channel technology (IMT) that has been patented and proven in SonicsSX and includes new layout optimization features for design flows based on modern physical synthesis and place & route tools. SoC architects using SonicsGN 3.0 can eliminate multi-channel DRAM access bottlenecks with IMT and reduce layout tool iterations with flexible user control of hierarchical RTL partitioning and re-timing stage insertion.

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Sonics Upgrades Designer Productivity and Power Analysis Capabilities in Next-Generation SoC Development Environment

SonicsStudio 8.0 Features Major Enhancements to the Director User Interface, Studio Generation Tools, and Automated Development Flow

Milpitas, Calif. – June 8, 2015  Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today introduced SonicsStudio 8.0, the latest release of its next-generation system-on-chip (SoC) development environment that includes improvements for both designer productivity and power analysis. In Release 8.0, Sonics has added major new features to all three areas of SonicsStudio: the Director user interface, the underlying SonicsStudio generation tools, and the automated development flows for stimulus generation, simulation, synthesis, and performance/power analysis.

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Sonics Introduces Semiconductor IP Industry’s First Power Management Solution Combining Fine-Grain Partitioning and Autonomous Control

ICE-Grain Power Architecture Saves More Energy than Conventional Approaches for Mainstream SoC Designs

Milpitas, Calif. – May 12, 2015  Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today introduced the ICE-Grain (Instant Control of Energy) Power Architecture for system-on-chip (SoC) design teams that require an automated power management solution with “worry-free implementation” at the highest level of abstraction. Sonics’ ICE-Grain Power Architecture is the semiconductor IP industry’s first and only complete power management sub-system comprised of configurable hardware IP blocks, embedded control software, and integrated design tool environment.

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eSilicon Uses Sonics’ Flagship On-chip Network in Complex SoC Design

Milpitas, Calif. – February 24, 2015  Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today announced that eSilicon Corporation has completed tape out of a system-on-chip (SoC) design using SonicsGN as the interconnect fabric. eSilicon selected SonicsGN to support its design requirements for rapid IP integration, high bandwidth with NoC throughput in the range of 500 GByte/sec, and ease of physical implementation and fast timing closure during place and route.

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