eSilicon Uses Sonics’ Flagship On-chip Network in Complex SoC Design

Milpitas, Calif. – February 24, 2015  Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today announced that eSilicon Corporation has completed tape out of a system-on-chip (SoC) design using SonicsGN as the interconnect fabric. eSilicon selected SonicsGN to support its design requirements for rapid IP integration, high bandwidth with NoC throughput in the range of 500 GByte/sec, and ease of physical implementation and fast timing closure during place and route.

eSilicon is a leading independent semiconductor design and manufacturing solutions provider that delivers custom ICs and custom IP to OEMs, integrated device manufacturers (IDMs), fabless semiconductor companies (FSCs), and wafer foundries through a fast, flexible, lower-risk, automated path to volume production.

“The fact that eSilicon completed this complex SoC design project in just a few months speaks to the quality of SonicsGN as a key element in platform-based design,” said Drew Wingard, CTO of Sonics. “The eSilicon design team leveraged SonicsGN’s high level of automation and its rapid adaptability to address the extreme combination of high frequency and large physical dimensions in meeting its aggressive SoC schedule. We look forward to seeing the results in silicon of this important design project.”

About Sonics, Inc.

Sonics, Inc. (Milpitas, Calif.) is the trusted leader in on-chip network (NoC) and power-management technologies used by the world’s top semiconductor and electronics product companies, including Broadcom, Intel, Marvell, MediaTek, and Microchip. Sonics was the first company to develop and commercialize NoCs, accelerating volume production of complex systems-on-chip (SoC) that contain multiple processor cores. Sonics’ ICE-Grain Power Architecture is the IP industry’s first complete power management solution, which enables SoC designers to exploit “dark silicon” states to save more energy than conventional software-based approaches. Sonics is also a catalyst for ongoing discussions about design methodology change via the Agile IC Methodology LinkedIn group. Sonics holds approximately 150 patent properties supporting customer products that have shipped more than four billion SoCs. For more information, visit sonicsinc.com, and follow us on Twitter (@sonicsinc) and LinkedIn.