SONICS PARTNERS WITH INOMIZE TO ENABLE AUTOMOTIVE CHIP DESIGN FOR ISO 26262 STANDARD

San Jose, Calif. – February 26, 2018 Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, announced a partnership with Inomize (Netanya, Israel) that enables chip designs to comply with the ISO 26262 automotive functional safety standard using Sonics’ NoCs with Inomize’s ASIC design platforms and services. Sonics and Inomize recently worked together in support of a top-tier semiconductor company for the successful implementation of advanced machine learning technologies targeted for automotive applications. This new partnership replicates that project’s success by offering automotive chip designers the IP and comprehensive services that overcome the challenges of ISO 26262 compliance. Continue reading “SONICS PARTNERS WITH INOMIZE TO ENABLE AUTOMOTIVE CHIP DESIGN FOR ISO 26262 STANDARD”

SONICS NoC CUSTOMER STARBLAZE TECHNOLOGY REACHES VOLUME PRODUCTION WITH STAR1000 SSD CONTROLLER SoC

San Jose, Calif. – February 5, 2018 Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, announced that its Chinese customer, Starblaze Technology, has reached volume production in TSMC’s 28HPC process technology with the STAR1000 solid state storage device (SSD) controller system-on-chip (SoC). Starblaze Technology used Sonics’ flagship SonicsGN® NoC as the integration fabric for more than 60 cores in the design. STAR1000 is a high-end client and entry-level enterprise storage SSD controller designed to deliver maximum flexibility and high performance with minimal power consumption, while meeting new security requirements for the SSD market. Continue reading “SONICS NoC CUSTOMER STARBLAZE TECHNOLOGY REACHES VOLUME PRODUCTION WITH STAR1000 SSD CONTROLLER SoC”

ICE-P3 EPU UPGRADE SIMPLIFIES CONTROL OF ON-CHIP AND EXTERNAL RESOURCES TO SAVE MORE POWER IN SoC AND MCU DESIGNS

New Programmable Sequencer Controls Frequency and Voltage Resources – PMICs, Voltage Regulators, PLLs, and Clock Generators – Better than CPUs

Santa Clara, Calif. – December 14, 2017 – REUSE2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, upgraded its ICE-P3™ Energy Processing Unit (EPU), the flagship member of the ICE-Grain™ Family of EPU products, to add a new programmable Sequencer. The Sequencer enables designers of power-sensitive chips like systems-on-chip (SoC) and microcontrollers (MCU) to significantly improve control over both on-chip and external voltage and frequency resources to minimize energy consumption. The Sequencer combines the flexibility of resource control offered by software-based solutions with the minimized latency, area, and power provided by hardware-based solutions. Continue reading “ICE-P3 EPU UPGRADE SIMPLIFIES CONTROL OF ON-CHIP AND EXTERNAL RESOURCES TO SAVE MORE POWER IN SoC AND MCU DESIGNS”

SONICS AND MOORTEC PARTNER TO PROVIDE TEMPERATURE-COMPENSATED DVFS CAPABILITY FOR SOC AND MCU DESIGNERS

New Power Management Solution Integrates Sonics’ Energy Processing Units with Moortec’s Temperature Sensors to Improve Energy Efficiency

ARM TechCon, Santa Clara, Calif. – October 25, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, and Moortec, specialists in embedded in-chip sensing, today announced their partnership that integrates the companies’ products to provide advanced power management techniques to system-on-chip (SoC) and MCU designers. The partnership couples Sonics’ ICE-P3™ with Moortec’s compelling Temperature Sensors to enable temperature-compensated, dynamic voltage and frequency scaling (DVFS) in chip designs intended for power-sensitive devices such as mobile/handheld and the Internet of Things (IoT). The partnership solution is available immediately. Continue reading “SONICS AND MOORTEC PARTNER TO PROVIDE TEMPERATURE-COMPENSATED DVFS CAPABILITY FOR SOC AND MCU DESIGNERS”

ICE-P3 EPU INTEGRATES TEMPERATURE-COMPENSATED VOLTAGE AND FREQUENCY CONTROL FOR MAXIMUM ENERGY SAVINGS

Newest ICE-Grain Family Member Expands Fully Autonomous Hardware Power Control to Include DVFS and Body Bias

San Jose, Calif. – June 26, 2017Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today introduced ICE-P3™, the IP industry’s first product to automate implementation of dynamic voltage and frequency scaling (DVFS). ICE-P3 is the newest member of the ICE-Grain™ Family of Energy Processing Units (EPU) that identifies, sequences, and controls power state transitions in hardware up to 500X faster than conventional software-based approaches. Continue reading “ICE-P3 EPU INTEGRATES TEMPERATURE-COMPENSATED VOLTAGE AND FREQUENCY CONTROL FOR MAXIMUM ENERGY SAVINGS”

ALTAIR SEMICONDUCTOR EMPLOYS SONICS’ NoC TO INTEGRATE BASEBAND IC OF ALT1250 IOT LTE CHIPSET

San Jose, Calif. – May 30, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Altair Semiconductor, a Sony company, used Sonics’ NoC as the integration fabric for the baseband IC of its new ALT1250, which is the most integrated LTE CAT-M1 and NB1 chipset available. The ALT1250 integrates an LTE baseband processor, RF transceiver, PMU, memory, PAs, filters and antenna switch, a GNSS and a cellular based location engine, as well as an IoT-optimized security framework. An ALT1250-based design requires only a few external components. This enables miniature module sizes of smaller than 100mm2 with standard low-cost PCB technology. Continue reading “ALTAIR SEMICONDUCTOR EMPLOYS SONICS’ NoC TO INTEGRATE BASEBAND IC OF ALT1250 IOT LTE CHIPSET”

ISRAEL’S VAYYAR IMAGING LICENSES SONICS NoC FOR USE IN 3D SENSOR CHIPS

San Jose, Calif. – May 23, 2017Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Vayyar Imaging (Tel Aviv, Israel) has licensed SonicsSX® and SonicsExpress™ for use in its 3D sensor chips. Vayyar’s powerful sensor technology (watch video) is revolutionizing breast cancer detection, robotics, smart-home, smart cities, automotive, smart electronic appliances and more. Its sensors see through skin and tissue to detect breast or other cancer masses, look through walls to detect structural foundations, and can track a person’s location and vital signs as they move through a smart home. Continue reading “ISRAEL’S VAYYAR IMAGING LICENSES SONICS NoC FOR USE IN 3D SENSOR CHIPS”

SONICS AND NORTHWEST LOGIC PARTNER ON HIGH THROUGHPUT MEMORY SUBSYSTEM SOLUTIONS

Focus on SOC Designs for Machine Learning, Computer Vision, UHD Video Processing, and Enterprise SSD Applications

San Jose, Calif. – May 9, 2017 – Sonics, Inc., the world’s foremost supplier of Network On-Chip (NoC) and power management technologies and services and Northwest Logic, a leading provider of high performance IP cores, today announced their partnership to deliver high throughput memory subsystem solutions for complex System-On-Chip (SOC) designs. The companies’ partnership, which is being driven by a mutual customer SOC design win, integrates Sonics’ flagship interconnect fabric, SonicsGN® NoC, and Sonics’ MemMax® memory scheduler with Northwest Logic’s family of HBM2, DDRx, LPDDRx memory controllers. Continue reading “SONICS AND NORTHWEST LOGIC PARTNER ON HIGH THROUGHPUT MEMORY SUBSYSTEM SOLUTIONS”

WAVE COMPUTING AND SONICS TO PRESENT ON DEEP LEARNING TECHNOLOGY AT ML DEVCON APRIL 27TH

“Overcoming the Memory System Challenge in Dataflow Processing”

San Jose, Calif. – April 25, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, and Wave Computing (http://wavecomp.ai/) today announced that the companies will jointly deliver a technical presentation on Deep Learning technology at the Machine Learning Developers Conference on Thursday, April 27th 2017. The title of the presentation is “Overcoming the Memory System Challenge in Dataflow Processing,” and it will be given by Darren Jones, VP Hardware Engineering of Wave, and Drew Wingard, CTO of Sonics. ML DevCon is being held at the Santa Clara, CA Convention Center and the presentation is scheduled for 11:55 am on April 27th. For more information, read the presentation abstract. Continue reading “WAVE COMPUTING AND SONICS TO PRESENT ON DEEP LEARNING TECHNOLOGY AT ML DEVCON APRIL 27TH”

ISRAEL’S BAR-ILAN UNIVERSITY PRODUCES COMPLEX SOC USING SonicsGN NoC AS INTEGRATION FABRIC

SoC Lab Attributes Fast Timing Closure to Sonics’ NoC Performance

San Jose, Calif. – March 28, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that the SoC Lab at Israel’s Bar-Ilan University has designed and fabricated a complex system-on-chip (SoC) based on an SoC platform that employs the SonicsGN® NoC as the top-level interconnect fabric. The student design team used SonicsGN to integrate 6 initiator cores and more than 50 targets in the research chip, which runs at 750 MHz and was manufactured in TSMC’s 28 nm process technology. Continue reading “ISRAEL’S BAR-ILAN UNIVERSITY PRODUCES COMPLEX SOC USING SonicsGN NoC AS INTEGRATION FABRIC”