ZCAN LICENSES SonicsGN NoC AND MemMax DRAM SCHEDULER FOR NEW CRYPTOCURRENCY CHIP DESIGN

Chinese Fabless Semiconductor Company Adopts Sonics IP to Accelerate Time-to-Market, Meet Performance and High Bandwidth Memory Requirements

San Jose, Calif. – September 18, 2018 Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, announced that it has licensed both SonicsGN® and MemMax  to ZCAN Microelectronics Technology, based in Shanghai, China. ZCAN plans to incorporate Sonics’ NoC and memory scheduling IP into its new cryptocurrency system-on-chip (SoC) design. Continue reading “ZCAN LICENSES SonicsGN NoC AND MemMax DRAM SCHEDULER FOR NEW CRYPTOCURRENCY CHIP DESIGN”

SONICS PARTNERS WITH SiFIVE TO SUPPORT AGILE RISC-V SOC DESIGN PLATFORM WITH IP INDUSTRY’S MOST WIDELY USED NOCs

San Jose, Calif. – July 2, 2018 Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, announced a partnership with SiFive, the leading provider of market-ready processor core IP based on the RISC-V instruction set architecture. Sonics and SiFive are enabling an agile RISC-V design platform for systems-on-chip (SoC) by making the Sonics’ NoCs interoperable with SiFive’s family of RISC-V Core IP. Sonics’ NoCs are the IP industry’s most widely adopted commercial interconnect fabric and have been shipped in billions of SoCs over the past 20 years. SiFive’s Core IPs are the most widely deployed RISC-V CPUs in the world and are the lowest risk, easiest path to RISC-V. Continue reading “SONICS PARTNERS WITH SiFIVE TO SUPPORT AGILE RISC-V SOC DESIGN PLATFORM WITH IP INDUSTRY’S MOST WIDELY USED NOCs”

SONICS PARTNERS WITH SYNKOM TO INCORPORATE NoC and EPU IP INTO ITS LEADING SEMICONDUCTOR DESIGN SERVICES FOR JAPAN CUSTOMERS

San Jose, Calif. – June 6, 2018 Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, announced a partnership with Synkom, a leading electronic design services firm in Japan, that incorporates NoC and Energy Processing Unit (EPU) IP into Synkom’s design flow for companies creating complex chips using Synkom’s services. Sonics will train Synkom chip design engineers to optimize NoCs and EPUs in their integration and power management methodologies to increase performance and lower power consumption for their customers’ chip design projects. Continue reading “SONICS PARTNERS WITH SYNKOM TO INCORPORATE NoC and EPU IP INTO ITS LEADING SEMICONDUCTOR DESIGN SERVICES FOR JAPAN CUSTOMERS”

SONICS PARTNERS WITH INOMIZE TO ENABLE AUTOMOTIVE CHIP DESIGN FOR ISO 26262 STANDARD

San Jose, Calif. – February 26, 2018 Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, announced a partnership with Inomize (Netanya, Israel) that enables chip designs to comply with the ISO 26262 automotive functional safety standard using Sonics’ NoCs with Inomize’s ASIC design platforms and services. Sonics and Inomize recently worked together in support of a top-tier semiconductor company for the successful implementation of advanced machine learning technologies targeted for automotive applications. This new partnership replicates that project’s success by offering automotive chip designers the IP and comprehensive services that overcome the challenges of ISO 26262 compliance. Continue reading “SONICS PARTNERS WITH INOMIZE TO ENABLE AUTOMOTIVE CHIP DESIGN FOR ISO 26262 STANDARD”

SONICS NoC CUSTOMER STARBLAZE TECHNOLOGY REACHES VOLUME PRODUCTION WITH STAR1000 SSD CONTROLLER SoC

San Jose, Calif. – February 5, 2018 Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, announced that its Chinese customer, Starblaze Technology, has reached volume production in TSMC’s 28HPC process technology with the STAR1000 solid state storage device (SSD) controller system-on-chip (SoC). Starblaze Technology used Sonics’ flagship SonicsGN® NoC as the integration fabric for more than 60 cores in the design. STAR1000 is a high-end client and entry-level enterprise storage SSD controller designed to deliver maximum flexibility and high performance with minimal power consumption, while meeting new security requirements for the SSD market. Continue reading “SONICS NoC CUSTOMER STARBLAZE TECHNOLOGY REACHES VOLUME PRODUCTION WITH STAR1000 SSD CONTROLLER SoC”

ICE-P3 EPU UPGRADE SIMPLIFIES CONTROL OF ON-CHIP AND EXTERNAL RESOURCES TO SAVE MORE POWER IN SoC AND MCU DESIGNS

New Programmable Sequencer Controls Frequency and Voltage Resources – PMICs, Voltage Regulators, PLLs, and Clock Generators – Better than CPUs

Santa Clara, Calif. – December 14, 2017 – REUSE2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, upgraded its ICE-P3™ Energy Processing Unit (EPU), the flagship member of the ICE-Grain™ Family of EPU products, to add a new programmable Sequencer. The Sequencer enables designers of power-sensitive chips like systems-on-chip (SoC) and microcontrollers (MCU) to significantly improve control over both on-chip and external voltage and frequency resources to minimize energy consumption. The Sequencer combines the flexibility of resource control offered by software-based solutions with the minimized latency, area, and power provided by hardware-based solutions. Continue reading “ICE-P3 EPU UPGRADE SIMPLIFIES CONTROL OF ON-CHIP AND EXTERNAL RESOURCES TO SAVE MORE POWER IN SoC AND MCU DESIGNS”

SONICS AND MOORTEC PARTNER TO PROVIDE TEMPERATURE-COMPENSATED DVFS CAPABILITY FOR SOC AND MCU DESIGNERS

New Power Management Solution Integrates Sonics’ Energy Processing Units with Moortec’s Temperature Sensors to Improve Energy Efficiency

ARM TechCon, Santa Clara, Calif. – October 25, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, and Moortec, specialists in embedded in-chip sensing, today announced their partnership that integrates the companies’ products to provide advanced power management techniques to system-on-chip (SoC) and MCU designers. The partnership couples Sonics’ ICE-P3™ with Moortec’s compelling Temperature Sensors to enable temperature-compensated, dynamic voltage and frequency scaling (DVFS) in chip designs intended for power-sensitive devices such as mobile/handheld and the Internet of Things (IoT). The partnership solution is available immediately. Continue reading “SONICS AND MOORTEC PARTNER TO PROVIDE TEMPERATURE-COMPENSATED DVFS CAPABILITY FOR SOC AND MCU DESIGNERS”

ICE-P3 EPU INTEGRATES TEMPERATURE-COMPENSATED VOLTAGE AND FREQUENCY CONTROL FOR MAXIMUM ENERGY SAVINGS

Newest ICE-Grain Family Member Expands Fully Autonomous Hardware Power Control to Include DVFS and Body Bias

San Jose, Calif. – June 26, 2017Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today introduced ICE-P3™, the IP industry’s first product to automate implementation of dynamic voltage and frequency scaling (DVFS). ICE-P3 is the newest member of the ICE-Grain™ Family of Energy Processing Units (EPU) that identifies, sequences, and controls power state transitions in hardware up to 500X faster than conventional software-based approaches. Continue reading “ICE-P3 EPU INTEGRATES TEMPERATURE-COMPENSATED VOLTAGE AND FREQUENCY CONTROL FOR MAXIMUM ENERGY SAVINGS”

ALTAIR SEMICONDUCTOR EMPLOYS SONICS’ NoC TO INTEGRATE BASEBAND IC OF ALT1250 IOT LTE CHIPSET

San Jose, Calif. – May 30, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Altair Semiconductor, a Sony company, used Sonics’ NoC as the integration fabric for the baseband IC of its new ALT1250, which is the most integrated LTE CAT-M1 and NB1 chipset available. The ALT1250 integrates an LTE baseband processor, RF transceiver, PMU, memory, PAs, filters and antenna switch, a GNSS and a cellular based location engine, as well as an IoT-optimized security framework. An ALT1250-based design requires only a few external components. This enables miniature module sizes of smaller than 100mm2 with standard low-cost PCB technology. Continue reading “ALTAIR SEMICONDUCTOR EMPLOYS SONICS’ NoC TO INTEGRATE BASEBAND IC OF ALT1250 IOT LTE CHIPSET”

ISRAEL’S VAYYAR IMAGING LICENSES SONICS NoC FOR USE IN 3D SENSOR CHIPS

San Jose, Calif. – May 23, 2017Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Vayyar Imaging (Tel Aviv, Israel) has licensed SonicsSX® and SonicsExpress™ for use in its 3D sensor chips. Vayyar’s powerful sensor technology (watch video) is revolutionizing breast cancer detection, robotics, smart-home, smart cities, automotive, smart electronic appliances and more. Its sensors see through skin and tissue to detect breast or other cancer masses, look through walls to detect structural foundations, and can track a person’s location and vital signs as they move through a smart home. Continue reading “ISRAEL’S VAYYAR IMAGING LICENSES SONICS NoC FOR USE IN 3D SENSOR CHIPS”