ICE-G3 EPU ADDS CLUSTER CONTROLLER TO SAVE MORE ENERGY FOR COMPLEX CHIP POWER ARCHITECTURES

San Jose, Calif. – March 15, 2017Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today introduced ICE-G3™, the second product in the Energy Processing Unit (EPU) family based on the ICE-Grain Power Architecture™. ICE-G3 includes all of the on-chip power management capabilities of ICE-G1™ EPU with the addition of a key new component called the cluster controller. The cluster controller supports definition of complex power states at the system level and implements those system states by closely coordinating the actions of up to 256 lower-level power grain controllers in an EPU design. Sonics has also enhanced its EPU Studio™ development environment to ease definition and automate generation of cluster controllers. Continue reading “ICE-G3 EPU ADDS CLUSTER CONTROLLER TO SAVE MORE ENERGY FOR COMPLEX CHIP POWER ARCHITECTURES”

Goke Licenses SonicsGN and MemMax Products for STB SoC Platform

San Jose, Calif. – February 21, 2017Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Goke Microelectronics, a leading Chinese provider of IP camera, STB, SSD, and IoT chips, has licensed the flagship SonicsGN® NoC along with the MemMax® memory scheduler IP. Goke will use Sonics’ IP products in development of an SoC platform targeted for STB designs. Continue reading “Goke Licenses SonicsGN and MemMax Products for STB SoC Platform”

Grant Pierce Named Chairman of the ESD Alliance Board of Directors

Elected to Chair 10-Member Board 

REDWOOD CITY, CALIF. ––  February 9, 2017 –– Grant A. Pierce, chief executive officer (CEO) of Sonics, Inc., supplier of on-chip network (NoC) and power management technologies and services, was elected by the Board of Directors of the Electronic System Design Alliance (ESD Alliance) to serve as its chairman. Continue reading “Grant Pierce Named Chairman of the ESD Alliance Board of Directors”

SonicsGN Provides Integration Fabric for Nexell NXP5540 Application Processor

San Jose, Calif. – February 7, 2017Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Nexell has implemented the flagship SonicsGN® NoC as the integration fabric in its recently introduced NXP5540 application processor. Nexell, founded in 2009, is a Korean-based developer of systems-on-chip (SoC), semiconductor IP, and application processors. The NXP5540 is manufactured in Samsung’s 28nm low-power Gate First High-k Metal Gate (HKMG) foundry process technology. Nexell also used SonicsStudio® as its SoC integration environment to drive design and verification within the Samsung EDA tool and manufacturing flows. Continue reading “SonicsGN Provides Integration Fabric for Nexell NXP5540 Application Processor”

Sonics Collaborates with GLOBALFOUNDRIES to Accelerate Adoption of Power and Performance Capabilities of the 22FDX® Process by SoC Designers

Sonics Plans Extension of EPU Product Line to Support

Control of 22FDX Body-biasing in Combination with DVFS

San Jose, Calif. – January 25, 2017Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced it will collaborate with GLOBALFOUNDRIES on energy processing unit (EPU) product development that leverages the power and performance optimization capabilities of the 22FDX® process technologies for the system-on-chip (SoC) design community. The collaboration seeks to raise the level of abstraction for SoC power control through the integration of 22FDX body-biasing techniques into Sonics’ comprehensive EPU products. Sonics will develop an extension of its EPU product line, based on the ICE-Grain™ Power Architecture, which supports GLOBALFOUNDRIES body-biasing library components to increase SoC performance, reduce SoC power consumption, and enable SoC designers to tightly tune margins for higher manufacturing yields. As part of the collaboration with GLOBALFOUNDRIES, Sonics has also joined the FDXcelerator™ Partner Program. Continue reading “Sonics Collaborates with GLOBALFOUNDRIES to Accelerate Adoption of Power and Performance Capabilities of the 22FDX® Process by SoC Designers”

MEDIATEK LICENSES SONICS’ NoC AND MEMORY SCHEDULER IP

San Jose, Calif. – January 10, 2017Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that MediaTek Inc., a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products, has licensed multiple copies of SonicsSX® NoC and the MemMax® memory scheduler IP.

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Sonics to conduct ‘Energy Processing Units for Power-Sensitive Chip Designs’ Seminar in Israel on Tuesday, November 8th

San Jose, Calif. – October 07, 2016  Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today announced that it has developed the IP industry’s first Energy Processing Unit (EPU) based on the company’s ICE-Grain (Instant Control of Energy) Power Architecture originally introduced in 2015. Sonics’ ICE-G1 product is a complete EPU enabling rapid design of system-on-chip (SoC) power architecture and implementation and verification of the resulting power management subsystem. ICE-G1 reduces chip power consumption up to 90 percent for both expert and first-time users.

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Do Chip Designers Worry About the Impact of Power Consumption on Sustainability Sonics and Semico Team Up for Power Management Best Practices Survey

San Jose, Calif. – October 3, 2016  Sonics, Inc. and Semico Research Corporation have launched the On-Chip Power Management Best Practices survey. The purpose of this industry survey is to understand how chip designers are managing power consumption and contrast that with expected future best practices. The companies will publish results of the survey on their web sites in the fall of 2016.

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Starblaze Integrates Enterprise Solid State Drive Controller Chip Using SonicsGN

San Jose, Calif. – August 23, 2016  Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Starblaze Technology has completed a new solid state drive (SSD) controller chip using SonicsGN to integrate more than 60 cores. Starblaze was founded in January, 2015 and offers world-class chip design capabilities from its research and development centers in Beijing, Shanghai, and Chengdu, China. The company selected SonicsGN as the NoC for this enterprise SSD controller chip design due to its advanced performance features, intuitive development environment, and support for standard EDA design flows. Starblaze completed tape out of this SSD controller chip in April, 2016 and is targeting it for volume production in TSMC’s 28HPC process technology later this year.

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Sonics Develops Industry’s First Energy Processing Unit Based on the ICE-Grain Power Architecture

“Energy Processing for Power-Sensitive SoCs”

Seminar Series Highlights Real-World Power Savings Using New ICE-G1 EPU

Milpitas, Calif. – May 2, 2016  Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today announced that it has developed the IP industry’s first Energy Processing Unit (EPU) based on the company’s ICE-Grain (Instant Control of Energy) Power Architecture originally introduced in 2015. Sonics’ ICE-G1 product is a complete EPU enabling rapid design of system-on-chip (SoC) power architecture and implementation and verification of the resulting power management subsystem. Sonics also announced the “Energy Processing for Power-Sensitive SoCs” seminar series which highlights power savings results from real-world customer use cases.

Continue reading “Sonics Develops Industry’s First Energy Processing Unit Based on the ICE-Grain Power Architecture”