ALTAIR SEMICONDUCTOR EMPLOYS SONICS’ NoC TO INTEGRATE BASEBAND IC OF ALT1250 IOT LTE CHIPSET

San Jose, Calif. – May 30, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Altair Semiconductor, a Sony company, used Sonics’ NoC as the integration fabric for the baseband IC of its new ALT1250, which is the most integrated LTE CAT-M1 and NB1 chipset available. The ALT1250 integrates an LTE baseband processor, RF transceiver, PMU, memory, PAs, filters and antenna switch, a GNSS and a cellular based location engine, as well as an IoT-optimized security framework. An ALT1250-based design requires only a few external components. This enables miniature module sizes of smaller than 100mm2 with standard low-cost PCB technology. Continue reading “ALTAIR SEMICONDUCTOR EMPLOYS SONICS’ NoC TO INTEGRATE BASEBAND IC OF ALT1250 IOT LTE CHIPSET”

ISRAEL’S VAYYAR IMAGING LICENSES SONICS NoC FOR USE IN 3D SENSOR CHIPS

San Jose, Calif. – May 23, 2017Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Vayyar Imaging (Tel Aviv, Israel) has licensed SonicsSX® and SonicsExpress™ for use in its 3D sensor chips. Vayyar’s powerful sensor technology (watch video) is revolutionizing breast cancer detection, robotics, smart-home, smart cities, automotive, smart electronic appliances and more. Its sensors see through skin and tissue to detect breast or other cancer masses, look through walls to detect structural foundations, and can track a person’s location and vital signs as they move through a smart home. Continue reading “ISRAEL’S VAYYAR IMAGING LICENSES SONICS NoC FOR USE IN 3D SENSOR CHIPS”

SONICS AND NORTHWEST LOGIC PARTNER ON HIGH THROUGHPUT MEMORY SUBSYSTEM SOLUTIONS

Focus on SOC Designs for Machine Learning, Computer Vision,

UHD Video Processing, and Enterprise SSD Applications

San Jose, Calif. – May 9, 2017 – Sonics, Inc., the world’s foremost supplier of Network On-Chip (NoC) and power management technologies and services and Northwest Logic, a leading provider of high performance IP cores, today announced their partnership to deliver high throughput memory subsystem solutions for complex System-On-Chip (SOC) designs. The companies’ partnership, which is being driven by a mutual customer SOC design win, integrates Sonics’ flagship interconnect fabric, SonicsGN® NoC, and Sonics’ MemMax® memory scheduler with Northwest Logic’s family of HBM2, DDRx, LPDDRx memory controllers. Continue reading “SONICS AND NORTHWEST LOGIC PARTNER ON HIGH THROUGHPUT MEMORY SUBSYSTEM SOLUTIONS”

WAVE COMPUTING AND SONICS TO PRESENT ON DEEP LEARNING TECHNOLOGY AT ML DEVCON APRIL 27TH

“Overcoming the Memory System Challenge in Dataflow Processing”

San Jose, Calif. – April 25, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, and Wave Computing (http://wavecomp.ai/) today announced that the companies will jointly deliver a technical presentation on Deep Learning technology at the Machine Learning Developers Conference on Thursday, April 27th 2017. The title of the presentation is “Overcoming the Memory System Challenge in Dataflow Processing,” and it will be given by Darren Jones, VP Hardware Engineering of Wave, and Drew Wingard, CTO of Sonics. ML DevCon is being held at the Santa Clara, CA Convention Center and the presentation is scheduled for 11:55 am on April 27th. For more information, read the presentation abstract. Continue reading “WAVE COMPUTING AND SONICS TO PRESENT ON DEEP LEARNING TECHNOLOGY AT ML DEVCON APRIL 27TH”

ISRAEL’S BAR-ILAN UNIVERSITY PRODUCES COMPLEX SOC USING SonicsGN NoC AS INTEGRATION FABRIC

SoC Lab Attributes Fast Timing Closure to Sonics’ NoC Performance

San Jose, Calif. – March 28, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that the SoC Lab at Israel’s Bar-Ilan University has designed and fabricated a complex system-on-chip (SoC) based on an SoC platform that employs the SonicsGN® NoC as the top-level interconnect fabric. The student design team used SonicsGN to integrate 6 initiator cores and more than 50 targets in the research chip, which runs at 750 MHz and was manufactured in TSMC’s 28 nm process technology. Continue reading “ISRAEL’S BAR-ILAN UNIVERSITY PRODUCES COMPLEX SOC USING SonicsGN NoC AS INTEGRATION FABRIC”

ICE-G3 EPU ADDS CLUSTER CONTROLLER TO SAVE MORE ENERGY FOR COMPLEX CHIP POWER ARCHITECTURES

San Jose, Calif. – March 15, 2017Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today introduced ICE-G3™, the second product in the Energy Processing Unit (EPU) family based on the ICE-Grain Power Architecture™. ICE-G3 includes all of the on-chip power management capabilities of ICE-G1™ EPU with the addition of a key new component called the cluster controller. The cluster controller supports definition of complex power states at the system level and implements those system states by closely coordinating the actions of up to 256 lower-level power grain controllers in an EPU design. Sonics has also enhanced its EPU Studio™ development environment to ease definition and automate generation of cluster controllers. Continue reading “ICE-G3 EPU ADDS CLUSTER CONTROLLER TO SAVE MORE ENERGY FOR COMPLEX CHIP POWER ARCHITECTURES”

Goke Licenses SonicsGN and MemMax Products for STB SoC Platform

San Jose, Calif. – February 21, 2017Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Goke Microelectronics, a leading Chinese provider of IP camera, STB, SSD, and IoT chips, has licensed the flagship SonicsGN® NoC along with the MemMax® memory scheduler IP. Goke will use Sonics’ IP products in development of an SoC platform targeted for STB designs. Continue reading “Goke Licenses SonicsGN and MemMax Products for STB SoC Platform”

Grant Pierce Named Chairman of the ESD Alliance Board of Directors

Elected to Chair 10-Member Board 

REDWOOD CITY, CALIF. ––  February 9, 2017 –– Grant A. Pierce, chief executive officer (CEO) of Sonics, Inc., supplier of on-chip network (NoC) and power management technologies and services, was elected by the Board of Directors of the Electronic System Design Alliance (ESD Alliance) to serve as its chairman. Continue reading “Grant Pierce Named Chairman of the ESD Alliance Board of Directors”

SonicsGN Provides Integration Fabric for Nexell NXP5540 Application Processor

San Jose, Calif. – February 7, 2017Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Nexell has implemented the flagship SonicsGN® NoC as the integration fabric in its recently introduced NXP5540 application processor. Nexell, founded in 2009, is a Korean-based developer of systems-on-chip (SoC), semiconductor IP, and application processors. The NXP5540 is manufactured in Samsung’s 28nm low-power Gate First High-k Metal Gate (HKMG) foundry process technology. Nexell also used SonicsStudio® as its SoC integration environment to drive design and verification within the Samsung EDA tool and manufacturing flows. Continue reading “SonicsGN Provides Integration Fabric for Nexell NXP5540 Application Processor”

Sonics Collaborates with GLOBALFOUNDRIES to Accelerate Adoption of Power and Performance Capabilities of the 22FDX® Process by SoC Designers

Sonics Plans Extension of EPU Product Line to Support

Control of 22FDX Body-biasing in Combination with DVFS

San Jose, Calif. – January 25, 2017Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced it will collaborate with GLOBALFOUNDRIES on energy processing unit (EPU) product development that leverages the power and performance optimization capabilities of the 22FDX® process technologies for the system-on-chip (SoC) design community. The collaboration seeks to raise the level of abstraction for SoC power control through the integration of 22FDX body-biasing techniques into Sonics’ comprehensive EPU products. Sonics will develop an extension of its EPU product line, based on the ICE-Grain™ Power Architecture, which supports GLOBALFOUNDRIES body-biasing library components to increase SoC performance, reduce SoC power consumption, and enable SoC designers to tightly tune margins for higher manufacturing yields. As part of the collaboration with GLOBALFOUNDRIES, Sonics has also joined the FDXcelerator™ Partner Program. Continue reading “Sonics Collaborates with GLOBALFOUNDRIES to Accelerate Adoption of Power and Performance Capabilities of the 22FDX® Process by SoC Designers”